DIFFUSION BONDING OF AL ALLOY USING DIFFERENT IINTERLAYERS

Abstract

The present study includes characterization of diffusion bonding of aluminum alloy 2024-O without and with applying different interlayers as pure powder such as copper, silver and titanium. Bonding was performed in vacuum up to (1×10-5 mbar) using vacuum system bonding. Aluminum alloy 2024-O specimens was used as cylinder shape as diameter (15mm) and (35mm) length and interlayer thickness was equal 100 ϻm, under bonding conditions of (330-480°C) and (1-4 Mpa) and duration of (60 min). Interlayer was classified according to diffusion coefficient of each element in the base alloy. Bonding joint under optimum conditions were examined for microstructure properties using light microscope, scanning electron microscope (SEM) with energy dispersive spectroscopy (EDS) for determining microstructure and depth diffusion and micro hardness was also used at bonding zone. XRD was used to determine the phase’s formation at bonding zone. XRD results show that the dominant intermetallic compound phase form was Al2Cu when enhancing the mechanical properties of the bond zone. The maximum depth of diffusion obtained was 19.2 ϻm.