BOND PAD DEFECT CALCULATION USING GRIDLINES

Authors

  • Frederick Ray I. Gomez, Nerie R. Gomez Author

Abstract

Provide specialized measurement tool for quantifying or measuring probe marks and bond pad-related defects, for Incoming Quality Control (IQC) station, Assembly Process Control, and for New Product Introduction (NPI)

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Published

2018-12-30

Issue

Vol. 5 No. 12 (2018): December 2018

Section

Articles